The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 01, 1993
Filed:
Dec. 17, 1990
Bruce M McWilliams, Pleasanton, CA (US);
Nicholas E Brathwaite, Hayward, CA (US);
David B Tuckerman, Dublin, CA (US);
nCHIP, Inc., San Jose, CA (US);
Abstract
An assembly structure and process for attaching integrated circuits to multichip modules and attaching the module to a printed circuit board. An epoxy loaded with diamond dust or boron nitride is used to attach the integrated circuit to the module. The dust material increases the thermal conductance of the epoxy for improved heat dissipation without substantially increasing the capacitance of interconnect routed underneath the epoxy. Reverse wedge wire bonding is also used to electrically connect the integrated circuit to the module allowing greater chip densities on the module surface. The chip/module assembly can then be mounted on a printed circuit board and the module leads wired directly to the board.