The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 18, 1993
Filed:
Apr. 13, 1990
Hiroo Ebisawa, Iruma, JP;
Katsumi Kohama, Saitama, JP;
Tomohisa Abe, Shiki, JP;
Hidemitsu Takizawa, Osaka, JP;
Daisuke Atobe, Suita, JP;
Kenichi Ueda, Takatsuki, JP;
Honda Giken Kogyo Kabushiki Kaisha, Tokyo, JP;
Nippon Shokubai Kagaku Kogyo Co., Ltd., Osaka, JP;
Abstract
The method for molding a resin reinforced with fiber wherein a resin sheet reinforced with fiber is positioned juxtaposed a face of a mold, which is either one of a female mold or a male mold, and then hardened, but before molding, modifying the viscosity to different levels in different portions of the resin sheet. Thus, it is possible to surely prevent occurrence of a partial difference in thickness of the moldings or, if necessary, to partially change these thicknesses according to predetermined values.