Active cooling apparatus for afterburners

Abstract

The present invention comprises at least one active cooling apparatus incorporated into the nozzle liner of sidewall of an afterburner. The liner has a plurality of cooling air holes located under the apparatus. Within the liner is a supply of cooling air under high pressure. Over the holes in the liner is flexibly attached the active cooling apparatus which is composed of an inner manifold having a bottom layer with a plurality of receiving holes therein which are offset from the supply holes of the liner and a top layer also having a plurality of vent holes therein which are further offset from the holes in the bottom layer. Attached over the inner manifold is a hot cover layer which is located a small distance above the inner manifold top layer. The hot cover layer also has a plurality of flow path holes therein. A hot gas stream flowing over the hot cover layer bleeds into the inner manifold. Due to the differences in thermal expansion rates of the bottom layer, the top layer and the hot cover layer, the layers bow out from the liner. When this occurs, the cooling air can flow out into the active cooling apparatus and into the hot exhaust gas and in so doing reduces the temperature of the active cooling apparatus and allows it to bow back to the liner and close the holes therebetween once the hot stream stops.