The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 04, 1993

Filed:

Mar. 27, 1991
Applicant:
Inventors:

Mitsuhiro Takarada, Gunma, JP;

Yuji Yoshikawa, Gunma, JP;

Kenji Yamamoto, Gunma, JP;

Hiroharu Ohsugi, Ohsaka, JP;

Atsushi Ohgaki, Kobe, JP;

Ryozo Takagawa, Ohsaka, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C08L / ;
U.S. Cl.
CPC ...
525100 ; 525103 ; 528 15 ; 528 26 ; 528 31 ;
Abstract

This invention discloses a curing resin composition comprising (a) an organic resin containing no less than 2 alkenyl groups per molecule, and having a number average molecular weight of 500-100,000. (b) an organohydrogen-polysiloxane containing no less than 2 Si--H bonds per molecule, and (c) a platinum catalyst. It is desired that the organic resin of component (a) is at least one type chosen from acrylic, polyester and epoxy. The preferable amount of component (b) is such that there are 0.8-4 hydrogen atoms bonded to silicon atoms per alkenyl group of component (a).


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