Process for making a multilayer lead frame assembly for an integrated

Abstract

A method is described for making a multilayer lead frame assembly for an integrated circuit die package comprising a planar metal lead frame; at least one layer of insulating tape, provided with a b-stage adhesive on each surface thereof; and a planar metal member capable of functioning as a ground plane layer and as a heat sink. The method comprises: bonding the planar metal lead frame, one or more insulating tapes, and planar metal member together as a multilayer lead frame assembly prior to mounting the integrated circuit die to the resulting multilayer lead frame assembly. The planar metal member and planar lead frame are respectively bonded to a surface of the insulating tape by bringing the metal member (or lead frame) into contact with the b-stage adhesive on the surface of the insulating tape and then heating the metal member (or lead frame) and the insulating tape to the curing temperature of the b-stage adhesive to bond the metal member (or lead frame) to the insulating tape. After assembly of the multilayer lead frame assembly, the integrated circuit die may be subsequently bonded to a surface of an insulating layer in the same manner or the die may be bonded directly to a surface of either the lead frame or the metal member using a conductive adhesive.