The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 04, 1993
Filed:
Jan. 21, 1992
Hiroshi Kawashimo, Itami, JP;
Mitsubishi Denki Kabushiki Kaisha, Tokyo, JP;
Abstract
A wire bonding apparatus includes a capillary tip through which a fine metal wire passes, a first clamp disposed above the capillary tip for clamping the fine metal wire, a second clamp disposed above the first clamp for clamping the fine metal wire, a first moving mechanism for moving the capillary tip up and down, and a second moving mechanism for moving the first clamp up and down with respect to the capillary tip in order that an excess length of the fine metal wire which protrudes from the capillary tip may be drawn back into the capillary tip. In a method of using the apparatus, the first clamp clamps the fine metal wire and retracts it through the capillary tip to avoid an excessive wire length between a ball bond and a wire bond in the completed product. The second clamp clamps the wire during the wire bonding process to ensure that excess retracted wire does not again pass through the capillary tip.