Method of producing an electronic circuit package

Abstract

An electronic circuit package which includes first and second conductive metal members and a circuit board held between the first and second metal members and having a cutout in which an electronic circuit part is accommodated and a process of producing such electronic circuit package are disclosed. With the electronic circuit package, deterioration of a high speed characteristic of an electronic circuit part accommodated in the package is minimized, and accordingly, when the electronic circuit package is applied to an IC for very high speed optical communications for use with an optical repeater or the like, a very high speed system can be realized. By assembling the components in accordance with a predetermined order, facility in process of production and improvement in reliability of products are attained.