The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 20, 1993
Filed:
Aug. 09, 1991
Robert Edelman, Staten Island, NY (US);
National Starch and Chemical Investment Holding Corporation, Wilmington, DE (US);
Abstract
This is a thermally conductive adhesive having excellent die shear strength, in film form, and having a weight average molecular weight of about 100,000 to 150,000, prepared from a mixture of a dietherdianhydride, a meta-substituted benzenediamine, a polysiloanediamine, and a thermally conductive filler, that is suitable as a die attach adhesive: it bonds rapidly without the need for curing or baking off-line; does not produce excess stress on the die; requires no refrigeration; provides uniform bond line thickness between the die and paddle; can be used at temperatures that do not oxidize copper lead frames or produce excessive thermal stress; can be reworked; and can exert adequate adhesion during the processes of wire bonding and molding.