The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 20, 1993
Filed:
Oct. 09, 1991
Norman S Loren, Warren, MI (US);
Other;
Abstract
A gas assisted injection molding method and apparatus wherein articles are produced by injecting molten resin into a mold cavity and then injecting a quantity of pressurized gas into the resin to fill out the mold cavity and form a hollow in the resin. Following the injection of the gas into the resin to form the hollow, gas is injected into the resin in the mold cavity at a second location. The gas injected at the second location may either form a separate hollow within the resin or may form a passage extending through the resin for communication with the hollow formed by the gas injected at the first location. The first location is preferably the resin injection location and the second location is preferably a location communicating directly with the mold cavity. Gas is vented from the article either at the first location, the second location, or both locations. The injection of the gas at the first and second locations, and the venting of the gas at the first and second locations, is separately controlled and regulated so that the gas may be injected at different pressures at the different locations, the gas may be injected or vented in a sequential manner at the different locations, and the gas may be vented from the first location until the pressure reaches a predetermined reduced level whereafter the gas may be vented from the second location to reduce the gas pressure to ambient.