The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 06, 1993

Filed:

Nov. 21, 1990
Applicant:
Inventors:

Takahiko Yamashita, Ebina, JP;

Akira Busujima, Hadano, JP;

Toshiyuki Makino, Kawasaki, JP;

Assignee:

Hitachi Seiko Ltd., Ebina, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G06F / ; B23H / ;
U.S. Cl.
CPC ...
36447404 ; 36447431 ; 219 6912 ;
Abstract

Ratios between a distance between an upper wire guide and the upper surface of a workpiece to be machined, a thickness of the workpiece and a distance between a lower wire guide and the lower surface of the workpiece are given to the inlet and outlet positions of a wire electrode at the upper and lower surfaces of the workpiece which have been interpolated so as to directly obtain displacement positions of the upper and lower wire guides, along which the upper and lower wire guides are moved successively, thereby obtaining an articles which is accurately machined with a relatively simple machining procedure.


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