The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 06, 1993
Filed:
Aug. 22, 1990
Applicant:
Inventors:
Ker M Chen, Hsinchu, TW;
Jing P Pan, Hsinchu, TW;
Gwo Y Shiau, Hsinchu, TW;
Tsung H Wang, Taipei, TW;
Wei C Chang, Taipei, TW;
Assignee:
Industrial Technology Research Institute, Hsinchu, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08L / ;
U.S. Cl.
CPC ...
525426 ; 525420 ; 4284735 ;
Abstract
A polyimide adhesive composition is a reaction product of polyamic acid and bismaleimide (I) modified by barbituric acid (II) or the derivatives thereof. Once the present composition is directly coated onto copper foil, the bonding force is greatly improved as compared to compositions without (II) or (I) and (II). Therefore, the adhesive normally used in the manufacture of flexible printed circuits boards and tape automated bonding (TAB) is no longer necessary.