logo

For the Inventor, By the Inventor

The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 5200474 B1

PDFFull Text
Date of Patent:
Apr. 06, 1993

Filed:

Aug. 22, 1990

Polyimide adhesive composition including barbituric acid modifier

Applicant:
Inventors:

Ker M Chen, Hsinchu, TW;

Jing P Pan, Hsinchu, TW;

Gwo Y Shiau, Hsinchu, TW;

Tsung H Wang, Taipei, TW;

Wei C Chang, Taipei, TW;

Assignee:

Industrial Technology Research Institute, Hsinchu, TW;

Attorney:

Scully, Scott, Murphy & Presser

Primary Examiner:

Ana L Carrillo

Int. Cl.
CPC ...
C08L / ;
U.S. Cl.
CPC ...
525426 ; 525420 ; 4284735 ;
Abstract

A polyimide adhesive composition is a reaction product of polyamic acid and bismaleimide (I) modified by barbituric acid (II) or the derivatives thereof. Once the present composition is directly coated onto copper foil, the bonding force is greatly improved as compared to compositions without (II) or (I) and (II). Therefore, the adhesive normally used in the manufacture of flexible printed circuits boards and tape automated bonding (TAB) is no longer necessary.

Find Patent Forward Citations

Chen, Ker. (1993). Polyimide adhesive composition including barbituric acid modifier (U.S. Patent No. 5200474). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/5200474

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Loading…