The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 06, 1993
Filed:
Dec. 13, 1989
Applicant:
Inventor:
Michio Osada, Kyoto, JP;
Assignee:
T&K International Laboratory, Ltd., Uji, JP;
Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B28B / ; B29C / ;
U.S. Cl.
CPC ...
264 39 ; 26427211 ; 264313 ; 425227 ;
Abstract
An electronic component is molded into a resin seal by first compressing a resin tablet to increase its density by removing air contained in the tablet. The compressed or molded resin tablet is supplied into a pot (3) wherein the tablet is melted by heat. The melted resin is injected under pressure into cavities (5a, 5b) through a transfer path (9), whereby electronic components (10) set in these cavities (5a, 5b) are seal molded. This method substantially prevents air from being mixed into the melted resin and also avoids the formation of a void within and on the surface of a resin sealed molding of the electronic components (10) encapsulated in the resin.