The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 06, 1993
Filed:
Dec. 03, 1991
Felix M Oshita, Santa Ana, CA (US);
Ronald L Campbell, Tustin, CA (US);
Theodore R Conroy-Wass, Tustin, CA (US);
Hughes Aircraft Company, Los Angeles, CA (US);
Abstract
Boards of a first group of mutually parallel circuit boards (200,206) are directly connected to boards (27a,22b) of a second group of mutually parallel circuit boards by interfitting hermaphroditic connectors (24,26,28,30) mounted on edges of the boards. The boards of one group are all perpendicular to the boards of the other group and are positioned in edge-to-edge relation. Each board has a plurality of hermaphroditic connectors secured to its edge, with each connector adapted to mate with an identical hermaphroditic connector secured at an edge of a board of the second group. The hermaphroditic connectors are each substantially U-shaped (24,26,28,30) in one embodiment and J-shaped (126,128,130) in another embodiment. Each such connector has a first section (66,68) parallel to the surface of the board and electrically connected thereto and a second section (70) extending at right angles to the first section for a pressure type connection to the similar second section of the mating hermaphroditic connector of a board of the second group. The mating second sections (70,70b) of the two mating connectors have pressure contact connection elements in the form of raised elongated strips (220,222) of conductive material that ease positioning tolerance of the interconnection.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile