The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 06, 1993
Filed:
Aug. 29, 1991
Applicant:
Inventor:
Kaoru Ishihara, Fukuoka, JP;
Assignee:
Mitsubishi Denki Kabushiki Kaisha, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B21F / ;
U.S. Cl.
CPC ...
140105 ; 72 37 ;
Abstract
An exterior lead forming device for semiconductor devices includes a pair of roller holders rotatably attached to a punch plate. When the punch plate is lowered, the leads of a semiconductor device fixedly held on a bending die by a pressing plate are bent along the sides of the bending die. The paths of the bending rollers are monitored by a camera and path errors, calculated by a comparator, are fed back to a motor control circuit to adjust the positions of bending roller guide plates and thereby correct the path errors.
Ishihara, Kaoru. (1993). Exterior lead forming device for semiconductor devices (U.S. Patent No. 5199469). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/5199469
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile