The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 30, 1993

Filed:

May. 10, 1990
Applicant:
Inventors:

Bruce M McGeoch, Cupertino, CA (US);

Scott E Richmond, San Jose, CA (US);

Assignee:

Quantum Corporation, Milpitas, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G06F / ;
U.S. Cl.
CPC ...
371 101 ; 371 102 ; 365200 ;
Abstract

A solid state memory array includes an address bus and a bidirectional data bus and a plurality of partly defective VLSI memory array chips each containing at least one megabit of data storage capacity, having defective memory cell locations, being connected to the address bus, and providing plural data storage bit positions. Each memory array chip has a bidirectional tri-state driver connected between the bit lines thereof and corresponding ones of the data bus. At least one VLSI substitution memory chip contains at least one megabyte of data storage capacity, is connected to the address bus and provides plural data storage bit positions. A substitution chip tri-state driver is connected between the bit lines of the substitution memory chip and all of the parallel data bit lines of the data bus. A programmable read only memory is connected to be addressed by the address bus and is programmed for putting out a binary coded value which has been coded to identify each said defective memory cell location of each one of the memory array chips. A decoder is connected to receive and decode the binary coded value into tri-state driver control values and applies the values to the substitution chip tri-state driver and to one of the memory array chip bidirectional tri-state drivers so as to disable the memory array chip associated with the particular chip driver when a defective memory cell location thereof is addressed, and to enable the substitution memory chip at the particular location and connect it to the data bus in place of the associated memory array chip.


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