The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 30, 1993
Filed:
Jul. 19, 1989
Kenji Takahashi, Tokyo, JP;
Yasuhiro Yamaji, Kanagawa, JP;
Susumu Harada, Kanagawa, JP;
Kazuichi Komenaka, Kanagawa, JP;
Mitsugu Miyamoto, Kanagawa, JP;
Masashi Muromachi, Kanagawa, JP;
Hiroshi Harada, Kanagawa, JP;
Kazuo Numajiri, Kanagawa, JP;
Haruyuki Shimakawa, Kanagawa, JP;
Toshiharu Sakurai, Kanagawa, JP;
Kabushiki Kaisha Toshiba, Kanagawa, JP;
Abstract
First and second frame bodies are used to fabricate a semiconductor device. The first frame body includes a die pad. The second frame body only includes a plurality of leads. The die pad is depressed by a predetermined amount which is equal or greater than the thickness of a semiconductor chip to be mounted on the die pad. The two frame bodies are welded, and wire bonding and cutting of the leads are performed.