The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 30, 1993

Filed:

Jan. 15, 1991
Applicant:
Inventors:

Hisaichi Muramoto, Hirakata, JP;

Yusuke Ninomiya, Nishinomiya, JP;

Keizou Ishii, Ashiya, JP;

Shinichi Ishikura, Tsuzuki, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C08F / ; C08F / ; C08L / ; C08L / ;
U.S. Cl.
CPC ...
525244 ; 525260 ; 525286 ; 525296 ; 525302 ; 525304 ; 525309 ; 525310 ; 525313 ; 525316 ; 525319 ; 525412 ; 525415 ; 525107 ; 525178 ; 525193 ; 525227 ; 525228 ; 528354 ; 526270 ;
Abstract

Disclosed is an improved process of the post-emulsion method capable of forming crosslinked resin particles which do not have fusion bonds between particles and which have good storage stability and good redispersibility in an aqueous medium. The process comprises (a) dispersing in an aqueous medium a resinous component comprising (I) a base resin having a glass transition temperature (Tg) of 0.degree. C. or less and a polymerizable double bond, (II) a monomer which, when polymerized, provides a resin of which Tg is 20.degree. C. higher than that of said base resin, or a resin of which Tg is 20.degree. C. higher than that of the base resin, and (III) a polyvinyl compound; (b) crosslinking inside the dispersed resin particles and; (c) removing the aqueous medium therefrom.


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