The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 30, 1993
Filed:
Oct. 07, 1991
Sekisui Kaseihin Kogyo Kabushiki Kaisha, Nara, JP;
Abstract
A method of forming molded articles having consistently or partially thin-walls by expanding expandable thermoplastic resin beads in a cavity formed between molds with the application of heat. The introduction of the resin beads is carried out after causing the width of a circumference section of the cavity to be greater than the diameter of the beads by moving one of or both of the molds in at least one direction orthogonal to a direction of closing the molds, the molds are then moved back to the normal positions, and the introduced resin beads are heated to form the molded article. Also, an expansion molding apparatus having a moving device such as a cylinder which moves the molds in at least one direction orthogonal to the closing direction during the introduction of the expandable thermoplastic resin beads, whereby consistently or partially thin-walled molded articles are manufactured.