The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 23, 1993
Filed:
Nov. 18, 1991
Applicant:
Inventors:
Mitsuaki Fujihira, Yokohama, JP;
Yoshiaki Tanaka, Yokohama, JP;
Assignee:
Sumitomo Electric Industries, Ltd., Osaka, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L / ;
U.S. Cl.
CPC ...
357 71 ; 357 67 ; 357 68 ;
Abstract
An integrated circuit device having an electronic circuit component connected by wire-bonding is characterized in that a masking member having a lower sputtering rate than that of the material forming the electrodes to be used for the wire-bonding is arranged around the electronic circuit component. A method for manufacturing an integrated circuit device having an electronic circuit component connected by wire-bonding is characterized in that a masking member having a lower sputtering rate than that of the material forming the electrodes to be used for the wire-bonding is arranged around the electronic circuit component.