Tape automated bonding test apparatus for thermal, mechanical and

Abstract

A test apparatus for a tape automated bonded component. The test apparatus includes a horizontally positioned printed circuit board having a plurality of conductive traces on an upper surface in an array corresponding to the leads of a tape automated bonding frame. The printed circuit board includes a central opening for entrance of a metallic heat transfer member. The tape automated bonding frame is aligned such that the component rests atop the heat transfer member and the leads of the frame are precisely positioned atop the conductive traces of the contact board. A reciprocating member is disposed above the frame for providing mechanical, electrical and thermal coupling of the frame to the test apparatus. A first elastomeric member is brought to bear on the backside of the component by cam action to thermally couple the component to the heat transfer member for purposes of burn-in testing and of channeling heat away from the component during testing other than burn-in. After thermal coupling has been achieved, a second elastomeric member provides a predetermined contact force to the leads of the frame at the region in which the leads are atop the conductive traces of the contact board, thereby providing the mechanical and electrical coupling. Input/output signals are channeled from a test performance board to the contact board via contact pins.