The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 23, 1993
Filed:
Aug. 20, 1991
John J Wagner, Eleva, WI (US);
Thomas P Chojnacki, River Falls, WI (US);
Delvin D Eberlein, Altoona, WI (US);
Cray Research, Inc., Eagan, MN (US);
Abstract
Silicon is used to create multi-chip carriers for integrated circuits. The process of fabricating the carriers uses standard integrated circuit fabrication equipment. Cavities are etched into a silicon wafer, metallization or polysilicon is deposited to electrically interconnect the cavities, and integrated circuit die are placed in the cavities. Traces connecting the integrated circuits are buried in channels formed in the silicon, which can be doped and biased to provide enhanced isolation between traces as well as control over the electrical characteristics of the traces. The traces can be formed in multiple layers of material placed on the wafer to provide additional communication capacity in the carriers.