The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 23, 1993

Filed:

Nov. 27, 1991
Applicant:
Inventors:

John R Dodd, Wilmington, DE (US);

Anthony J Arduengo, III, Wilmington, DE (US);

Randal D King, Wilmington, DE (US);

Americus C Vitale, West Chester, PA (US);

Assignee:

McGean-Rohco, Inc., Cleveland, OH (US);

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C23C / ; B05D / ;
U.S. Cl.
CPC ...
106-122 ; 106-123 ; 106-124 ; 106-125 ; 106-126 ; 106-127 ; 106-128 ; 106-129 ; 427 98 ; 427437 ; 4274431 ;
Abstract

An environmentally innocuous effective replacement for thiourea is disclosed for use as a complexing agent in displacement plating processes in which the plating solution is applied to the substrate surface to be plated by immersion or by spraying, cascading, pouring and the like. The replacement complexing agent is an imidazole-2-thione compound having the formula: ##STR1## wherein A and B are the same or different --R--Y groups, wherein R is linear, branched or cyclic alkenyl group containing 1 to 12 carbon atoms and Y is a hydrogen, halogen, cyano, vinyl, phenyl, or ether moiety. Of this class of compounds, 1-methyl-3-propyl-imidazole-2-thione is preferred for immersion tin plating. This class of complexing agents is particularly useful in spray displacement tin plating for the manufacture of printed circuit boards wherein free tin metal is added to the plating solution.


Find Patent Forward Citations

Loading…