The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 23, 1993
Filed:
Oct. 24, 1990
Takashi Kameda, Amagasaki, JP;
Nobuyoshi Takahashi, Amagasaki, JP;
Takeo Yoshioka, Amagasaki, JP;
Kenichi Mori, Amagasaki, JP;
Masahiro Ashiya, Amagasaki, JP;
Mitsubishi Denki Kabushiki Kaisha, Tokyo, JP;
Abstract
A boiling type cooling device for cooling power semiconductors includes an evaporator containing an aqueous solution of ethylene glycol as a cooling medium, a condenser; and a vapor and liquid return pipe. According to a first aspect, the lowest portion of the condensor is at a level higher than the top surface of the cooling medium in the evaporator, the bottom surfaces of the condensor being tilted downward toward the top end of the liquid return pipe. According to another aspect, a pump is provided in the liquid return pipe for driving cooling medium to the evaporator. According to still other aspects, the liquid return pipe is covered with a heat insulating material, or a rubber string extends centrally therewithin. A deaeration device for the aqueous solution of ethylene glycol includes two separate deaeration baths and a mixing bath.