The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 23, 1993
Filed:
Feb. 25, 1991
Toshio Hatada, Tsuchiura, JP;
Hitoshi Matsushima, Ibaraki, JP;
Yoshihiro Kondou, Ibaraki, JP;
Hiroshi Inoue, Ibaraki, JP;
Kanji Otsuka, Higashiyamato, JP;
Yuji Shirai, Kodaira, JP;
Takao Ohba, Hadano, JP;
Akira Yamagiwa, Hadano, JP;
Hitachi, Ltd., Tokyo, JP;
Abstract
An LSI cooling apparatus having various structures is used in electronic devices such as computer systems. In particular, the LSI cooling of apparatus is suitable for cooling of LSIs having high heat generating densities. In a cooling apparatus of the present invention, a heat sink is constructed to be small in pressure loss and excellent in cooling performance. This is because the heat sink comprises thin wire fins so set that the Reynold's number may not exceed 40. As a result, LSIs generating a large amount of heat can be cooled. Further, a heat sink having rigidity can be obtained by disposing wide-width wire drawn substances in thin wires or by using supports. Further, a computer comprising LSIs equipped with heat sinks can cope with various cooling air sending methods and it can be cooled with low noises.