The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 16, 1993
Filed:
Oct. 29, 1991
Applicant:
Inventor:
Dennis L Olmstead, Sherman, TX (US);
Assignee:
Texas Instruments Incorporated, Dallas, TX (US);
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B24B / ; B24B / ;
U.S. Cl.
CPC ...
5128 / ; 5128 / ; 511311 ; 511312 ; 511314 ; 51236 ;
Abstract
A method and apparatus for polishing semiconductor wafers in which a force applied to the wafer is uniformly distributed across a surface of the wafer during polishing using a hydrostatic or compliant material situated between the wafer and a piston. In a preferred embodiment, the hydrostatic or compliant material is an elastic solid or fluid filled bag. One or more teflon disks or teflon coated surfaces may be included between the hydrostatic or compliant material and a second compliant layer to form a bearing to allow the wafer to rotate about its central axis during polishing.