The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 09, 1993
Filed:
Oct. 23, 1991
Kaoru Sonobe, Tokyo, JP;
NEC Corporation, Tokyo, JP;
Abstract
A plastic semiconductor device has a lead frame provided with an island for received a semiconductor element. A plurality of leads project from a square outer frame and are distributed around the periphery of the island. An insulating substrate covers and is bonded to one principal surface of the island while exposing the semiconductor element. Distributing wires are formed on one principal surface of the insulating substrate to conform with the leads. A conductive substance connects the distributing wires to the leads and fills any through-holes formed in the insulating substrate. Bonding wires connect input-output terminals of the semiconductor element to the leads. A resin body encloses and embeds the bonding wires and the semiconductor element. A heat sink may be bonded to the back face of the island.