The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 09, 1993
Filed:
Oct. 02, 1991
Applicant:
Inventors:
Hideaki Kawashima, Sagamihara, JP;
Kouhei Eguchi, Sagamihara, JP;
Assignee:
Nippon Steel Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23B / ;
U.S. Cl.
CPC ...
279 71 ; 118503 ; 279110 ;
Abstract
A device for supporting a wafer comprises a base plate for arranging the wafer thereabove and a plurality of supports circumferentially arranged on the base plate to support the peripheral of the wafer. In order to expose portions of the wafer covered by the supports, either an annular member to engage with the supports for moving them radially outward, or a roller driven by a motor to rotate the wafer relative to the supports is provided.
Quick Actions:
Kawashima, Hideaki. (1993). Device for supporting a wafer (U.S. Patent No. 5192087). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/5192087
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile