The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 02, 1993
Filed:
Nov. 21, 1991
Shinichi Ogura, Kawagoe, JP;
Hiroo Adachi, Kawagoe, JP;
Osamu Shishido, Kawagoe, JP;
Tetsuya Watanabe, Kawagoe, JP;
Yuuichi Mineo, Kawagoe, JP;
Tohru Kageyama, Kawagoe, JP;
Yoichi Nishiyama, Kawagoe, JP;
Takashi Yamaguchi, Kawagoe, JP;
Keiichi Ogawa, Kawagoe, JP;
Pioneer Electronic Corporation, Tokyo, JP;
Abstract
A heat sink/circuit board assembly allows repairing or inspection of circuit or parts without impairing heat-radiating effect. A sub-heat sink is protruded from a lateral end of the circuit board in a direction parallel to the main surface of the circuit board and is connected to the main heat sink at its protruding portion. The diameter of the opening of the recessed portion of the main heat sink facing the circuit board is made larger than outer diameter of the circuit board. When circuit elements on the main surface of the circuit board facing the recessed portion of the main heat sink are to be repaired or inspected, the main heat sink is connected to the sub-heat sink on a main surface which is on the opposite side to the surface carrying the circuit elements, while the same heat-radiating effect as in the normal condition can be obtained.