The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 02, 1993

Filed:

Dec. 19, 1989
Applicant:
Inventors:

Yasuhiro Tomita, Neyagawa, JP;

Yoshiyuki Takagi, Osaka, JP;

Shigenobu Akiyama, Hirakata, JP;

Kenichi Yamazaki, Osaka, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L / ; H01L / ; H01L / ;
U.S. Cl.
CPC ...
257777 ; 257763 ; 257765 ;
Abstract

Disclosed is a three-dimensionally stacked LSI having a plurality of integrated-circuit layers stacked together, each of which is equipped with a plurality of circuit elements. Each of the circuit elements are equipped a power terminal of its own, which is connected through interlayer via-hole wiring to the power wiring of the uppermost integrated-circuit layer. The power wiring of the uppermost integrated-circuit layer is formed of a metal exhibiting a low electrical resistance, for example, Al, whereas the metal wirings of the other layers, which are exposed to high temperatures when forming the upper layers, are formed of W.


Find Patent Forward Citations

Tomita, Yasuhiro. (1993). Three-dimensional stacked lsi (U.S. Patent No. 5191405). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/5191405

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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