The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 23, 1993
Filed:
May. 08, 1992
Applicant:
Inventors:
Toshio Nakane, Shizuoka, JP;
Hiroaki Konuma, Shizuoka, JP;
Toshio Shiwaku, Shizuoka, JP;
Kenji Hijikata, Shizuoka, JP;
Assignee:
Polyplastics Co., Ltd., Osaka, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C08G / ;
U.S. Cl.
CPC ...
528272 ; 528298 ; 528301 ; 528302 ; 528307 ; 528308 ;
Abstract
A heat-resistant moldable copolyester resin is the copolymerization reaction product of a diol monomer component comprised mainly of 1,4-cyclohexanedimethanol, and an acid monomer component which includes first and second carboxylic acid comonomers. The first acid comonomer is a napthalenedicarboxylic acid or an ester-forming derivative thereof, while the second acid comonomer is 4,4'-diphenyldicarboxylic acid or an ester-forming derivative thereof. The first and second comonomers are present in amounts which satisfy the molar fraction ratio: