The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 23, 1993
Filed:
Dec. 06, 1991
Applicant:
Inventors:
Whan G Kim, Seoul, KR;
Tai Y Nam, Kyungki-do, KR;
Assignee:
Cheil Industries, Inc., Taegu-si, KR;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C08G / ; C08G / ; C08G / ; C08G / ;
U.S. Cl.
CPC ...
523443 ; 523466 ; 525481 ; 525482 ; 525484 ; 528 96 ; 549551 ; 549553 ;
Abstract
The present invention relates to novel epoxy resin compositions for sealing semiconductor elements, which comprise 0.1 to 20.0% by weight of imide-epoxy resins represented by the general formula (I) together with epoxy resins, curing agents, curing promoters and plasticizers, and which has improved heat resistant and moisture resistant properties: ##STR1## wherein, R.sub.1 and R.sub.2 represent H or --CH.sub.2).sub.n CH.sub.3 group, and