The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 23, 1993
Filed:
Jan. 31, 1992
Klaus Heyke, Reutlingen-Ohmenhausen, DE;
Richard Spitz, Reutlingen, DE;
Hans-Joachim Seidel, Waiblingen-Neustadt, DE;
Irene Jennrich, Winnenden Birkmannsweiler, DE;
Werner Pfander, Fellbach, DE;
Armin Vohr, Reutlingen, DE;
Robert Bosch GmbH, Stuttgart, DE;
Abstract
An encapsulating resin composition for electrical and electronic components consists of cycloaliphatic epoxy resin, a hardener, an accelerator, a filler and, sometimes, a pigment. As a result of the combination of the cycloaliphatic epoxy resin with the provision of methylnadic anhydride as hardener and amporhous SiO.sub.2 as a filler, the material is capable of flowing at room temperature, is physiologically harmless and also otherwise well suited for mass production of a wide variety of electrical and electronic components, for example diodes and other semi-conductors for the motor vehicle industry. A small addition of hollow glass spherical particles counteracts sedimentation of amorphous SiO.sub.2 in pre-hardening storage of the resin.