The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 16, 1993

Filed:

Mar. 25, 1991
Applicant:
Inventor:

Thomas A Tacklind, San Martin, CA (US);

Assignee:

Quantum Corporation, Milpitas, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G11B / ; H05K / ;
U.S. Cl.
CPC ...
360 9702 ; 174 / ; 174 / ; 360 9703 ;
Abstract

Apparatus providing improved RFI/EMI shielding includes a base of conductive material, such as cast or forged aluminum alloy, the base defining a substantially continuous floor and integrally formed base sidewalls extending upwardly from the floor along the periphery thereof. The base sidewalls define an inset-stepped region above an upper outer peripheral ledge extending around the periphery of the base sidewalls. A plurality of closely spaced apart, knife-blade protrusions formed along the edge extend upwardly from the ledge and angle inwardly toward the base sidewalls within the inset-stepped region. A cover, substantially congruent with the base defines a ceiling and integral cover sidewalls extending downwardly to fit closely over the inset-stepped region so as to come into engagement with the knife-blade protrusions. A clamping arrangement, such as plural spaced apart screws passing through peripheral openings of the cover and entering threaded bores in the base for example, cause the cover securely to clamp down over the base such that facing portions of the cover are deformed over the knife-blade protrusions of the base, thereby establishing very low impedance, closely spaced apart contacts along the gap between the cover and base, for grounding out RFI/EMI.


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