The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 16, 1993
Filed:
Nov. 18, 1991
NGK Spark Plug Co., Ltd., Nagoya, JP;
Abstract
In the joining structure of the solid electrolytic element, terminals connected to the heating element and the electrodes are attached through metallic oxide layers onto the solid electrolytic layer. The thermal conductivity coefficient of the metallic oxide layers is larger than that of the solid electrolytic layer. The thermal expansion coefficient of the metallic oxide layers is the same as or smaller than that of the solid electrolytic layer. Consequently, when the lead wires are soldered to the terminals, heat is quickly conducted to the terminals, enhancing the fluidity and the solderability of the soldering material. Since excess heating is not required for soldering, the solid electrolytic layer is prevented from deteriorating due to heat. Since a low-melting solder is not used, the joining structure has high heat resistance. Moreover, during soldering, the metallic oxide layers do not detach from the solid electrolytic layer due to heat.