The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 16, 1993
Filed:
Sep. 09, 1991
Applicant:
Inventor:
Gu S Kim, Seoul, KR;
Assignee:
Samsung Electronics, Co., Ltd., Suweon, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L / ;
U.S. Cl.
CPC ...
228123 ; 2281802 ; 228175 ;
Abstract
A semiconductor chip bonding process is disclosed, and the process comprises the steps of forming a first Au ball using a wire ball bump bonding apparatus, stacking a second Au ball on the first Au ball, stacking a Pb ball on the second Au ball using the wire ball bump bonding apparatus, and bonding the chip to a substrate, wherein the conventional complicated BUMP manufacturing process is omitted due to the CHIP BONDING technique during the assembling process, so that the formation process is shortened and the defect rate during the chip bonding is minimized, thereby the manufacturing cost can be saved.