The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 09, 1993
Filed:
Oct. 16, 1991
Mark L Miller, Chandler, AZ (US);
Other;
Abstract
A high dielectric sheet material comprises a monolayer of spaced high dielectric chips (e.g., ceramic single layer capacitor or SLC chips) which have been located or placed within spaced openings or windows formed in a dielectric spacer sheet. Top and bottom conductive sheets, preferably metallic foil sheets, are adhesively placed in intimate mechanical and electrical contact with the respective top and bottom external surfaces of the chips and dielectric spacer sheet. An adhesive is interposed between the metallic foil sheets and the dielectric spacer sheet (filled with high dielectric chips) such that the adhesive material holds the substrate together without interfering with electrical contact between the high dielectric chips and top and bottom foil sheets. This is preferably accomplished through the use of roughened surfaces formed on both the foil sheets and external high dielectric chips. The resultant high dielectric sheet material of this invention is drillable, platable, printable, etchable, laminable and highly reliable. In addition, this high dielectric sheet material may be used in a variety of electronic applications including as a component in the manufacture of multilayer circuit boards, capacitive elements and bus bars.