The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 19, 1993

Filed:

Jul. 25, 1991
Applicant:
Inventors:

Jean-Michel Bauer, Pagny S/Moselle, FR;

Maurice Bontems, Pagny S/Moselle, FR;

Assignee:

Le Carbone Lorraine, Courbevoie, FR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B / ; B32B / ; C01B / ;
U.S. Cl.
CPC ...
156 89 ; 156251 ; 156267 ; 1563077 ; 264 295 ; 264152 ; 264163 ; 264296 ; 423448 ;
Abstract

Process for producing carbon composite components having an edge and a central part with at least one layer of carbon/carbon composite and at least one layer of recompressed expanded graphite to obtain a sealing carbon composite component with a central part having a high deformation level and/or with an edge providing self-bonding of the layers of the component. There is prepared a stack of at least one layer of preimpregnate based on carbon fiber and of at least one layer of expanded graphite of a specific gravity of between 0.03 and 0.06. The stack is compressed under a pressure of between 2.5 and 15 MPa and at a temperature of between 50.degree. and 200.degree. C., in such a way that the thickness of the edge is at least equal to that of the central part and the specific gravity of the expanded graphite is between 0.3 and 0.6 for the edge and between 1 and 1.5 for the central part. The compressed component is treated thermally at a temperature of between 400.degree. and 3000.degree. C. Composite components produced according to this process and their use in the production of heat-exchanger plates and pervaporation modules also is disclosed.


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