The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 19, 1993
Filed:
Jul. 24, 1991
Applicant:
Inventor:
Kenshi Kondo, Tokyo, JP;
Assignee:
Nihon Den-Netsu Keiki Co., Ltd., Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B23K / ; B23K / ;
U.S. Cl.
CPC ...
2281801 ; 228-62 ; 228232 ; 392408 ; 392416 ; 392417 ;
Abstract
A method and apparatus for reflow-soldering of printed circuit boards are disclosed. A printed circuit board having electronic parts with lead wires having low temperature resistance alone or together with electronic part of high temperature resistance can be soldered according to the reflow-soldering method in a specifically designed heating zone involving plural preheating chambers and a reflowing chamber while maintaining a difference in temperature between the obverse surface and the reverse surface of the board without causing any soldering failure and any environmental pollution.