The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 12, 1993

Filed:

Mar. 30, 1990
Applicant:
Inventors:

Shinpei Yamamoto, Otsu, JP;

Hideyuki Ohashi, Otsu, JP;

Tadashi Nakajima, Otsu, JP;

Nobukazu Kotera, Otsu, JP;

Takuma Kobayashi, Tsuruga, JP;

Hiroshi Taki, Otsu, JP;

Masami Oka, Tsuruga, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C08F / ; C08F / ; B32B / ; C08G / ;
U.S. Cl.
CPC ...
4284258 ; 522 96 ; 525450 ; 525451 ; 525455 ;
Abstract

A radiation curable resin having at least two (meth)acryloyl groups at both terminal ends of a molecular chain which is obtained by reaction of (1) a polyester polyol and/or polycarbonate polyol, (2) a diisocyanate, (3) a polyfunctional (meth)acrylate containing a hydroxyl group therein, and optionally (4) a compound having at least two active hydrogens in the molecule is disclosed. The resin has at least two (meth)acryloyl groups at a terminal end of the molecular chain. The molecular weight of the resin is 1,000 to 50,000, the urethane bonding concentration is not more than 3,000 equivalent/10.sup.6 g and the (meth)acryloyl group concentration is 100 to 6,000 equivalent/10.sup.6 g. A radiation curable resin composition containing the resin and a precoated metal using the composition are also disclosed.


Find Patent Forward Citations

Loading…