The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 12, 1993
Filed:
Jan. 15, 1992
James C Swift, Olathe, KS (US);
Other;
Abstract
A hand-operated device for the precise positioning of electronic components on a printed circuit board (PCB) to assist in the assembly, repair or rework of PCB's. The device has a base ring with three adjustable-length legs which rest on or straddle the PCB. An x-ring is slidably mounted to the base ring and is moved in the direction of the x-axis by an actuator. A y-ring is slidably mounted to the x-ring and is moved in the direction of the y-axis by an actuator. A .theta.-ring is removably mounted on the y-ring and can rotate about the z-axis. A hub, which houses the z-actuator, is supported within the .theta.-ring by one or more arms. A grasping device, such as a vacuum gripper, is mounted on the z-actuator. In use, the device is positioned over a bonding site on the PCB, and the z-.theta. assembly is lifted off of the x-y base. An electronic component, such as an integrated circuit (IC), is picked up with the vacuum gripper and the z-.theta. assembly is replaced on the x-y base. The position of the IC is adjusted with the x- and y-actuators and the orientation is adjusted by rotating the .theta.-ring so that it is precisely positioned over the bonding site. The IC is then lowered onto the bonding site and released. The device is also adaptable to hold optical devices and processing tools, such as soldering or desoldering tools.