The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 05, 1993
Filed:
Jul. 29, 1991
Hideo Suda, Imaichi, JP;
Norimasa Sato, Utsunomiya, JP;
Katsuhiko Takada, Anjo, JP;
Sumio Susa, Anjo, JP;
Yasushi Aiyoshizawa, Nikko, JP;
Kenichi Omata, Imaichi, JP;
The Furukawa Electric Co., Ltd., Tokyo, JP;
Nippondenso Co., Ltd., Kariya, JP;
Abstract
A copper fin material for heat-exchangers is characterized in that, on the surface of Cu or Cu alloy strip, an inner side diffused layer comprising Cu and Zn and a surface side diffused layer provided on the surface side thereof comprising Cu, Zn and elements with a lower diffusion coefficient into Cu than that of Zn is formed. A method of producing the same is characterized in that, after an alloy film comprising Zn and element with a lower diffusion coefficient into Cu than that of Zn is formed on the surface of a Cu or Cu alloy strip, a diffusion treatment is performed under heat so that, on the surface of the Cu or Cu alloy strip, an inner side diffused layer comprising Cu and Zn and a surface side diffused layer provided on the surface side thereof comprising Cu, Zn and elements with a lower diffusion coefficient into Cu than that of Zn are formed. Alternatively, the diffusion treatment under heat is combined with a rolling processing step.