The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 05, 1993

Filed:

Jul. 09, 1990
Applicant:
Inventors:

Kenneth R Thompson, Sunrise, FL (US);

Anthony B Suppelsa, Coral Springs, FL (US);

Assignee:

Motorola, Inc., Schaumburg, IL (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C04B / ; B32B / ;
U.S. Cl.
CPC ...
156 89 ; 264 61 ; 264 66 ;
Abstract

A method of manufacturing a ceramic substrate with improved mounting pad location tolerances. The method begins with a green non-dimensionally stable ceramic base 10 to which at least one conductive layer 15, 16 such as a tungsten mixture is screen printed. The tungsten layer locationally defines a pattern including pads 15. This composite assembly is subsequently stabilized as in firing and a second insulating ceramic slurry layer with openings 29 located over the relative larger pads is screen printed on the stabilized composite assembly. This method eliminates tolerances in final mounting pad location due to unpredictable shrinkage and yet maintains excellent mounting pad adhesion since the entire pad overlays some portion of the tungsten pad.


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