The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 29, 1992
Filed:
Apr. 01, 1992
LSI Logic Corporation, Milpitas, CA (US);
Abstract
A first heat sink disposed immediately below and closely adjacent a semiconductor chip in a semiconductor chip assembly is disclosed. The heat sink is a flat metallic or ceramic shim. A second heat sink disposed immediately above and closely adjacent the semiconductor device is disclosed. The second heat sink preferably has a flat surface forming an exterior surface of the semiconductive device assembly . In one embodiment, the second heat sink has pedestals resting atop a plastic layer in a tape-like structure within the semiconductor chip assembly. In a second embodiment, the second heat sink includes an add-on portion that is external to the semiconductor chip assembly. The first heat sink is particularly well-suited to applications where the semiconductor chip assembly is mounted to a thermal mass. The second heat sink is particularly well-suited to applications where air cooling is available. Each of the first and second heat sinks provide effective cooling, and when used together provide even more effective cooling.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile