The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 29, 1992

Filed:

Jun. 03, 1992
Applicant:
Inventors:

Takeshi Tanaka, Hino, JP;

Hitoshi Mitake, Hino, JP;

Shigeru Kobayashi, Hino, JP;

Assignee:

Konica Corporation, Tokyo, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B05D / ;
U.S. Cl.
CPC ...
4274071 ; 427409 ; 427412 ; 4274122 ; 4274123 ; 4274125 ; 4274198 ; 427420 ;
Abstract

A method of coating a first resin solution containing a polymerization inducer on a moving web-like support with a coating device, comprising conveying the support to pass near the coating device without coming in contact with the coating device, disposing the first resin solution in a form of a first resin solution layer from the coating device onto the support; the first resin solution layer having a lower surface which faces the support and an upper surface opposite to the lower surface; and the coating device having a first release point at which the upper surface leaves the coating device and a second release point at which the lower surface leaves the coating device; overlaying the first release point with a solvent, thereby superimposing a solvent layer on the upper surface of the first resin solution layer; overlaying the second release point with a second resin solution which does not contain a polymerization inducer, thereby superimposing a second resin solution layer on the lower surface of the first resin solution layer; and applying the superimposed layers onto the support so that the solvent layer forms an uppermost layer on the support.


Find Patent Forward Citations

Loading…