The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 29, 1992
Filed:
May. 28, 1991
Alexander J Elliott, Mesa, AZ (US);
Motorola, Inc., Schaumburg, IL (US);
Abstract
A duo-cavity multigang pot molding assembly (10) for encapsulating semiconductor devices having an annular cavity (11) to form a molded carrier ring and an inner cavity (12) adapted to receive the item to be encapsulated. An outer mold pot (16) provides encapsulating material for the annular cavity (11) whereas a separate mold pot (17) provides encapsulating material for the inner cavity (12). Encapsulating material for the mold pots (16, 17) may be the same or in a preferred embodiment, different. Molding apparatus (10) promotes improved process control by delivering encapsulating material with a lower and more uniform viscosity to both the annular cavity (11) and the inner cavity (12). Further, use of separate mold pots (16, 17) allows cost savings because a less expensive encapsulating material may be used for molding the molded carrier ring since a high purity encapsulating material is not needed.