The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 22, 1992
Filed:
Apr. 25, 1991
Applicant:
Inventors:
Assignee:
Mitsubishi Denki Kabushiki Kaisha, Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K / ;
U.S. Cl.
CPC ...
361395 ; 361392 ; 361401 ; 361399 ; 364708 ; 235488 ; 235492 ; 257687 ;
Abstract
An IC card includes a thin plate forming an external surface of the card, a circuit board formed on an internal surface of the thin plate, and a frame surrounding peripheries of the thin plate and the circuit board. A space defined by the frame and the surface plate is filled with molded resin. A portion of an inner peripheral surface of the frame projects into the resin. The molded resin completely covers a surface of the circuit board and integrates the frame and the thin plate.
Kodai, Shojiro. (1992). Molded ic card (U.S. Patent No. 5173840). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/5173840
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile