The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 22, 1992
Filed:
Mar. 05, 1992
Joseph P Tomase, Libertyville, IL (US);
Shiuh-Hui Chen, Lake Zurich, IL (US);
Gregory D Stamm, LaGrange, IL (US);
Marc K Chason, Schaumburg, IL (US);
Motorola, Inc., Schaumburg, IL (US);
Abstract
A hermetically sealed interface is constructed with a substrate (101) having a first surface (103) with a first orifice (201). The substrate (101) also has an opposing second surface (105) with a second orifice (205). The first and second orifices (201, 205) are connected via a passageway (107). The passageway (107) has an inner surface (209) with a first metal coating (111). The first metal coating (111) and the substrate (101) provide a first predetermined thermal coefficient of expansion for the passageway (107). A plug (221) with an outer surface (223) has a second metal coating (225). The second metal coating (225) and the plug (221) provide a second predetermined thermal coefficient of expansion substantially similar to the first predetermined thermal coefficient of expansion of the passageway (107). The plug (221) is disposed in the passageway (107) of the substrate (101). The first metal coating (111), of the inner surface ( 209) of the passageway (107), and the second metal coating (225), of the outer surface (223) of the plug (221), are bonded together and provide, with the plug, (221) a hermetic barrier between the first and second orifices (201, 205) of the substrate (101). Preferably, this hermetically sealed interface is used in a capacitive pressure sensor.