The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 22, 1992
Filed:
Sep. 06, 1990
Setuo Toyoshima, Tokyo, JP;
Megumi Kimura, Kawasaki, JP;
Honshu Paper Co., Ltd., , JP;
Abstract
A composite material for electrical applications reinforced by a para-oriented aramide fibrous substance made of a para-oriented aramide fibrous substance selected from the group consisting of poly(p-phenylene terephthalamide) fiber and poly(p-phenylene-3,4'-diphenyl ether terephthalamide) fiber, a thermosetting resin matrix and a polymer having at least one specific reactive cross-linking group selected from the group consisting of carboxyl group, epoxy group, hydroxyl group and methylol group. The polymer resides at the interface between the para-oriented aramide fibers and the thermosetting resin matrix. The composite material for electrical applications can be prepared according to a method having the steps of treating a para-oriented aramide fibrous substance selected from the group consisting of poly(p-phenylene terephthalamide) fiber and poly(p-phenylene-3,4'-diphenyl ether terephthalamide) fiber with an emulsion containing a polymer carrying at least one reactive cross-linking group selected from the group consisting of carboxyl, epoxy, hydroxyl and methylol groups and a particle size ranging from 0.01 to 0.08 .mu., drying the treated fibrous substance and then laminating the fibrous substance with a thermosetting resin matrix. The composite material shows excellent properties well suited for use, in particular, as a composite material for electrical applications or a reinforcing substrate such as a printed circuit board or an insulating laminate.