The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 15, 1992

Filed:

Nov. 21, 1991
Applicant:
Inventors:

Jyuichiro Ozawa, Kyoto, JP;

Kikuo Wakino, Kyoto, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01B / ; H05K / ;
U.S. Cl.
CPC ...
361401 ; 174 / ;
Abstract

A flat capacitor-containing wiring board, which can be arranged optionally in the interior of a multilayer substrate. This capacitor-containing wiring board has a dielectric substrate which is made of a mixture of dielectric powder and resin, and conductors which are provided on both major surfaces of the dielectric substrate. The conductors can be etched and shaped so as to form capacitors which use the interior of the wiring board as their dielectric layers. With this wiring board, it is possible to etch the conductors so that the values of the capacitors can be freely selected over a wide range, the wiring board is flexible to some extent, and no pinholes or defects are defined over a wide area. Preferably, the board has a greater relative resin content near its surfaces than in its interior, which improves the dielectric characteristics of the board. The increased resin content may be provided by resin adhesive layers on the surfaces which permeate the board to some extent.


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