Low-inductance package for multiple paralleled devices operating at high

Abstract

A low-inductance package for multiple paralleled devices includes an electrically insulating substrate having three power terminals direct-bonded to the upper surface thereof and a conductive pad direct-bonded to the lower surface thereof for connection to a heat sink. Two groups of multiple parallel-coupled devices are each soldered to one of the three power terminals and are further connected in a half-bridge configuration such that one of the three power terminals is common to both groups of devices. The package further includes a pair of first Kelvin terminals, i.e., a first Kelvin control terminal and a first Kelvin source terminal, and a pair of second Kelvin terminals, i.e., a second Kelvin control terminal and a second Kelvin source terminal. The Kelvin terminals are soldered to the appropriate power terminals, depending upon the particular circuit configuration. The multiple parallel-coupled devices of each group are aligned such that the lengths of the wire bonds to the respective control and power terminals are substantially the same and furthermore are shortened. As a result, the stray inductance due to the wire bonds is the same for each group of devices and is minimized. Current sharing and simultaneous switching of devices within each group are thus ensured.